dc.contributor.author | Ivankovic, Andrej | |
dc.contributor.author | Vanstreels, Kris | |
dc.contributor.author | Hsu, Yung-Yu | |
dc.contributor.author | Gonzalez, Mario | |
dc.contributor.author | Brizar, Guy | |
dc.contributor.author | Vanderstraeten, Daniel | |
dc.contributor.author | Blansaer, Eddy | |
dc.contributor.author | Gillon, Renaud | |
dc.contributor.author | Defloor, M. | |
dc.contributor.author | Vandaele, K. | |
dc.contributor.author | Degryse, D. | |
dc.contributor.author | Vandevelde, Bart | |
dc.date.accessioned | 2021-10-19T14:29:53Z | |
dc.date.available | 2021-10-19T14:29:53Z | |
dc.date.issued | 2011-04 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19112 | |
dc.source | IIOimport | |
dc.title | Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: characterisation methods and implementation in FEM | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vanstreels, Kris | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.source.peerreview | no | |
dc.source.conference | 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE | |
dc.source.conferencedate | 18/04/2011 | |
dc.source.conferencelocation | Linz Austria | |
imec.availability | Published - imec | |