Technology assessment of through-silicon via by using C-V and C-t Measurements

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Authors

Katti, Guruprasad; Stucchi, Michele; Velenis, Dimitrios; Thangaraju, Sarasvathi; De Meyer, Kristin; Dehaene, Wim; Beyne, Eric

ISSN

0741-3106

Issue

7

Journal

IEEE Electron Device Letters

Volume

32

Title

Technology assessment of through-silicon via by using C-V and C-t Measurements

Publication type

Journal article

Embargo date

9999-12-31

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