Outperformance of Cu pillar flip chip bumps in electromigration testing

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Authors
Labie, Riet; Dosseul, Franck; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Beyne, Eric; Vandevelde, Bart
Conference
61st Electronic Components and Technology Conference - ECTC
Title
Outperformance of Cu pillar flip chip bumps in electromigration testing
Publication type
Proceedings paper
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