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dc.contributor.authorLe, Quoc Toan
dc.contributor.authorVereecke, Guy
dc.contributor.authorBertha, Anne
dc.contributor.authorKesters, Els
dc.contributor.authorLux, Marcel
dc.contributor.authorStruyf, Herbert
dc.date.accessioned2021-10-19T15:18:45Z
dc.date.available2021-10-19T15:18:45Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19262
dc.sourceIIOimport
dc.titleEffect of chemical solutions and surface wettability on the stability of advanced porous low-k materials
dc.typeProceedings paper
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewyes
dc.source.beginpage1335-o03-02
dc.source.conferenceMaterials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics
dc.source.conferencedate26/04/2011
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMRS Symposium Proceedings; Vol. 1335


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