Show simple item record

3D interconnect and packaging technology

dc.contributor.authorMercha, Abdelkarim
dc.date.accessioned2021-10-19T16:14:35Z
dc.date.available2021-10-19T16:14:35Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19414
dc.sourceIIOimport
dc.title3D interconnect and packaging technology
dc.typeOral presentation
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.source.peerreviewno
dc.source.conferenceSOI Conference
dc.source.conferencedate3/10/2011
dc.source.conferencelocationTempe, AZ USA
imec.availabilityPublished - imec
imec.internalnotesShort Course


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record