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Dopant and carrier profiling for 3D-device architectures

dc.contributor.authorMody, Jay
dc.contributor.authorKambham, Ajay Kumar
dc.contributor.authorZschaetzsch, Gerd
dc.contributor.authorChiarella, Thomas
dc.contributor.authorCollaert, Nadine
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorEyben, Pierre
dc.contributor.authorGilbert, Matthieu
dc.contributor.authorKoelling, Sebastian
dc.contributor.authorSchulze, Andreas
dc.contributor.authorHoffmann, Thomas Y.
dc.contributor.authorVandervorst, Wilfried
dc.date.accessioned2021-10-19T16:27:06Z
dc.date.available2021-10-19T16:27:06Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19444
dc.sourceIIOimport
dc.titleDopant and carrier profiling for 3D-device architectures
dc.typeProceedings paper
dc.contributor.imecauthorChiarella, Thomas
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorEyben, Pierre
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecChiarella, Thomas::0000-0002-6155-9030
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceInternational Workshop on Junction Technology
dc.source.conferencedate7/06/2011
dc.source.conferencelocationKyoto Japan
imec.availabilityPublished - open access


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