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Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorLabie, Riet
dc.contributor.authorVanstreels, Kris
dc.contributor.authorFranquet, Alexis
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorVerlinden, Bert
dc.date.accessioned2021-10-19T16:51:50Z
dc.date.available2021-10-19T16:51:50Z
dc.date.issued2011
dc.identifier.issn0022-2461
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19506
dc.sourceIIOimport
dc.titleImpact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
dc.typeJournal article
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage3868
dc.source.endpage3882
dc.source.journalJournal of Materials Science
dc.source.issue11
dc.source.volume46
imec.availabilityPublished - imec


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