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Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
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Authors
Okoro, Chukwudi
;
Labie, Riet
;
Vanstreels, Kris
;
Franquet, Alexis
;
Gonzalez, Mario
;
Vandevelde, Bart
;
Beyne, Eric
;
Vandepitte, Dirk
;
Verlinden, Bert
ISSN
0022-2461
Issue
11
Journal
Journal of Materials Science
Volume
46
Title
Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
Publication type
Journal article
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