Publication:

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Date

2011
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorLabie, Riet
dc.contributor.authorVanstreels, Kris
dc.contributor.authorFranquet, Alexis
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorVerlinden, Bert
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T16:51:50Z
dc.date.available2021-10-19T16:51:50Z
dc.date.issued2011
dc.identifier.issn0022-2461
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19506
dc.source.beginpage3868
dc.source.endpage3882
dc.source.issue11
dc.source.journalJournal of Materials Science
dc.source.volume46
dc.title

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

dc.typeJournal article
dspace.entity.typePublication
Files
Publication available in collections:
Articles