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Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
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Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
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Date
2011
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Okoro, Chukwudi
;
Labie, Riet
;
Vanstreels, Kris
;
Franquet, Alexis
;
Gonzalez, Mario
;
Vandevelde, Bart
;
Beyne, Eric
;
Vandepitte, Dirk
;
Verlinden, Bert
Journal
Journal of Materials Science
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1876
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Acq. date: 2025-12-10
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Metrics
Views
1876
since deposited on 2021-10-19
1
last month
Acq. date: 2025-12-10
Citations