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Chemical mechanical polishing of Ge using colloidal silica particles and H2O2

dc.contributor.authorOng, Patrick
dc.contributor.authorPeddeti, Shivaji
dc.contributor.authorLeunissen, Peter
dc.contributor.authorBabu, S. V.
dc.date.accessioned2021-10-19T16:53:49Z
dc.date.available2021-10-19T16:53:49Z
dc.date.issued2011
dc.identifier.issn1099-0062
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19511
dc.sourceIIOimport
dc.titleChemical mechanical polishing of Ge using colloidal silica particles and H2O2
dc.typeJournal article
dc.contributor.imecauthorOng, Patrick
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.source.peerreviewyes
dc.source.beginpage254
dc.source.endpage257
dc.source.journalElectrochemical and Solid-State Letters
dc.source.issue7
dc.source.volume14
dc.identifier.urlhttp://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=ESLEF600001400000700H254000001&idtype=cvips&gifs=yes
imec.availabilityPublished - imec


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