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Design and characterization of a biocompatible packaging concept for implantable electronic devices

dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorQian, Karen
dc.contributor.authorMalachowski, Karl
dc.contributor.authorFiorini, Paolo
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-19T16:56:31Z
dc.date.available2021-10-19T16:56:31Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19518
dc.sourceIIOimport
dc.titleDesign and characterization of a biocompatible packaging concept for implantable electronic devices
dc.typeProceedings paper
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.source.peerreviewno
dc.source.conferenceIMAPS 44th International Symposium on Microelectronics
dc.source.conferencedate9/10/2011
dc.source.conferencelocationLong Beach, CA USA
imec.availabilityPublished - imec


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