dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Cherman, Vladimir | |
dc.contributor.author | Stucchi, Michele | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Marchal, Pol | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-19T16:56:57Z | |
dc.date.available | 2021-10-19T16:56:57Z | |
dc.date.issued | 2011-03 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19519 | |
dc.source | IIOimport | |
dc.title | Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.imecauthor | Stucchi, Michele | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | yes | |
dc.source.beginpage | 131 | |
dc.source.endpage | 137 | |
dc.source.conference | IEEE/CPMT 27th Semiconductor Thermal Measurement & Management Symposium - SEMI-THERM | |
dc.source.conferencedate | 20/03/2011 | |
dc.source.conferencelocation | San Jose, CA USA | |
imec.availability | Published - imec | |