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Fine grain thermal modelling and expermintal validation of 3D-ICs

dc.contributor.authorOprins, Herman
dc.contributor.authorSrinivasan, Adi
dc.contributor.authorCupak, Miroslav
dc.contributor.authorCherman, Vladimir
dc.contributor.authorTorregiani, Cristina
dc.contributor.authorStucchi, Michele
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorVandevelde, Bart
dc.contributor.authorCheng, Ed
dc.date.accessioned2021-10-19T16:57:51Z
dc.date.available2021-10-19T16:57:51Z
dc.date.issued2011-04
dc.identifier.issn0026-2692
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19521
dc.sourceIIOimport
dc.titleFine grain thermal modelling and expermintal validation of 3D-ICs
dc.typeJournal article
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.beginpage572
dc.source.endpage578
dc.source.journalMicroelectronics Journal
dc.source.issue4
dc.source.volume42
dc.identifier.urlhttp://dx.doi.org/10.1016/j.mejo.2010.08.006
imec.availabilityPublished - imec


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