Fine grain thermal modelling and expermintal validation of 3D-ICs

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Authors

Oprins, Herman; Srinivasan, Adi; Cupak, Miroslav; Cherman, Vladimir; Torregiani, Cristina; Stucchi, Michele; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Cheng, Ed

ISSN

0026-2692

Issue

4

Journal

Microelectronics Journal

Volume

42

Title

Fine grain thermal modelling and expermintal validation of 3D-ICs

Publication type

Journal article

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