Publication:

Fine grain thermal modelling and expermintal validation of 3D-ICs

Date

2011-04
Journal article
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dc.contributor.authorOprins, Herman
dc.contributor.authorSrinivasan, Adi
dc.contributor.authorCupak, Miroslav
dc.contributor.authorCherman, Vladimir
dc.contributor.authorTorregiani, Cristina
dc.contributor.authorStucchi, Michele
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorVandevelde, Bart
dc.contributor.authorCheng, Ed
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned2021-10-19T16:57:51Z
dc.date.available2021-10-19T16:57:51Z
dc.date.issued2011-04
dc.identifier.issn0026-2692
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19521
dc.identifier.urlhttp://dx.doi.org/10.1016/j.mejo.2010.08.006
dc.source.beginpage572
dc.source.endpage578
dc.source.issue4
dc.source.journalMicroelectronics Journal
dc.source.volume42
dc.title

Fine grain thermal modelling and expermintal validation of 3D-ICs

dc.typeJournal article
dspace.entity.typePublication
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