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Fine grain thermal modelling and expermintal validation of 3D-ICs
Publication:
Fine grain thermal modelling and expermintal validation of 3D-ICs
Date
2011-04
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Srinivasan, Adi
;
Cupak, Miroslav
;
Cherman, Vladimir
;
Torregiani, Cristina
;
Stucchi, Michele
;
Van der Plas, Geert
;
Marchal, Pol
;
Vandevelde, Bart
;
Cheng, Ed
Journal
Microelectronics Journal
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1916
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
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Views
1916
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations