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3D-stacking of UTCPs as a module miniaturisation technology

dc.contributor.authorPriyabadini, Swarnakamal
dc.date.accessioned2021-10-19T17:34:36Z
dc.date.available2021-10-19T17:34:36Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19608
dc.sourceIIOimport
dc.title3D-stacking of UTCPs as a module miniaturisation technology
dc.typeOral presentation
dc.source.peerreviewno
dc.source.conference44th International Symposium on Microelectronics - IMAPS
dc.source.conferencedate9/10/2011
dc.source.conferencelocationLong Beach, CA USA
imec.availabilityPublished - imec


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