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3D-stacking of UTCPs as a module miniaturisation

dc.contributor.authorPriyabadini, Swarnakamal
dc.contributor.authorGielen, An
dc.contributor.authorDhaenens, Kristof
dc.contributor.authorChristiaens, Wim
dc.contributor.authorVan Put, Steven
dc.contributor.authorKunkel, G.
dc.contributor.authorPetersen, A.E.
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-19T17:35:03Z
dc.date.available2021-10-19T17:35:03Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19609
dc.sourceIIOimport
dc.title3D-stacking of UTCPs as a module miniaturisation
dc.typeProceedings paper
dc.contributor.imecauthorDhaenens, Kristof
dc.contributor.imecauthorVan Put, Steven
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage463
dc.source.endpage468
dc.source.conference44th International Symposium on Microelectronics - IMAPS
dc.source.conferencedate9/10/2011
dc.source.conferencelocationLong Beach, CA USA
imec.availabilityPublished - open access


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