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Imec ITF: The next wave of applications, with chips designed in 3D
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Imec ITF: The next wave of applications, with chips designed in 3D
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Date
2011-05
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Provoost, Jan
Journal
ElectroIQ
Abstract
Description
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1830
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Acq. date: 2026-01-11
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Views
1830
since deposited on 2021-10-19
1
last month
1
last week
Acq. date: 2026-01-11
Citations