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Crack initiation for kerf-loss-free wafering

dc.contributor.authorQian, Jun
dc.contributor.authorKersschot, Bruno
dc.contributor.authorMasolin, Alex
dc.contributor.authorVaes, Jan
dc.contributor.authorDross, Frederic
dc.contributor.authorReynaerts, Dominiek
dc.date.accessioned2021-10-19T17:45:25Z
dc.date.available2021-10-19T17:45:25Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19636
dc.sourceIIOimport
dc.titleCrack initiation for kerf-loss-free wafering
dc.typeProceedings paper
dc.source.peerreviewno
dc.source.beginpage458
dc.source.endpage461
dc.source.conference11th International Conference of the European Society for Precision Engineering & Nanotechnology - euspen
dc.source.conferencedate23/05/2011
dc.source.conferencelocationComo Italy
dc.identifier.urlhttp://www.euspen.eu/default.asp?langid=1&contentid=1451
imec.availabilityPublished - imec


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