dc.contributor.author | Qian, Karen | |
dc.contributor.author | Op de Beeck, Maaike | |
dc.contributor.author | Malachowski, Karl | |
dc.contributor.author | Miyazaki, Tomokazu | |
dc.contributor.author | O'Callaghan, John | |
dc.contributor.author | Van Hoof, Chris | |
dc.date.accessioned | 2021-10-19T17:46:41Z | |
dc.date.available | 2021-10-19T17:46:41Z | |
dc.date.issued | 2011 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19639 | |
dc.source | IIOimport | |
dc.title | Biocompatible and flexible packaging for implantable electronic devices | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Op de Beeck, Maaike | |
dc.contributor.imecauthor | O'Callaghan, John | |
dc.contributor.imecauthor | Van Hoof, Chris | |
dc.contributor.orcidimec | Op de Beeck, Maaike::0000-0002-2700-6432 | |
dc.source.peerreview | no | |
dc.source.conference | 3rd Flexible & Stretchable Electronics Workshop | |
dc.source.conferencedate | 15/11/2011 | |
dc.source.conferencelocation | Berlin Germany | |
imec.availability | Published - imec | |