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Copper plating for 3D interconnects

dc.contributor.authorRadisic, Alex
dc.contributor.authorLuhn, Ole
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorHonore, Mia
dc.contributor.authorRodet, Simon
dc.contributor.authorArmini, Silvia
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorBender, Hugo
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-19T17:48:00Z
dc.date.available2021-10-19T17:48:00Z
dc.date.issued2011
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19642
dc.sourceIIOimport
dc.titleCopper plating for 3D interconnects
dc.typeJournal article
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage701
dc.source.endpage704
dc.source.journalMicroelectronic Engineering
dc.source.issue5
dc.source.volume88
dc.identifier.urlhttp://dx.doi.org/10.1016/j.mee.2010.06.030
imec.availabilityPublished - imec


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