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Copper plating for 3D interconnects
Publication:
Copper plating for 3D interconnects
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Date
2011
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Radisic, Alex
;
Luhn, Ole
;
Philipsen, Harold
;
El-Mekki, Zaid
;
Honore, Mia
;
Rodet, Simon
;
Armini, Silvia
;
Drijbooms, Chris
;
Bender, Hugo
;
Ruythooren, Wouter
Journal
Microelectronic Engineering
Abstract
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1996
since deposited on 2021-10-19
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last month
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last week
Acq. date: 2025-12-10
Citations
Metrics
Views
1996
since deposited on 2021-10-19
1
last month
1
last week
Acq. date: 2025-12-10
Citations