Publication:

Copper plating for 3D interconnects

Date

2011
Journal article
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Author(s)

Radisic, Alex  
;
Luhn, Ole
;
Philipsen, Harold  
;
El-Mekki, Zaid  
;
Honore, Mia
;
Rodet, Simon
;
Armini, Silvia  
;
Drijbooms, Chris  
;
Bender, Hugo  
;
Ruythooren, Wouter  

Journal

Microelectronic Engineering

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2007 since deposited on 2021-10-19
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