Copper plating for 3D interconnects

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Authors

Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter

ISSN

0167-9317

Issue

5

Journal

Microelectronic Engineering

Volume

88

Title

Copper plating for 3D interconnects

Publication type

Journal article

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