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TSV Cu plating and implications for CMP

dc.contributor.authorRadisic, Alex
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorHonore, Mia
dc.contributor.authorWang, Y.S.
dc.contributor.authorHeylen, Nancy
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorArmini, Silvia
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorRodet, Simon
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorBender, Hugo
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorVanstreels, Kris
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-19T17:48:33Z
dc.date.available2021-10-19T17:48:33Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19643
dc.sourceIIOimport
dc.titleTSV Cu plating and implications for CMP
dc.typeProceedings paper
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewyes
dc.source.beginpage11
dc.source.endpage21
dc.source.conferenceElectronics and 3-D Packaging 4
dc.source.conferencedate10/10/2011
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttp://www.ecsdl.org/vsearch/servlet/VerityServlet?KEY=ECSTF8&ONLINE=YES&smode=strresults&sort=rel&maxdisp=25&threshold=0&pjourn
imec.availabilityPublished - imec
imec.internalnotesECS Transactions; Vol. 33, Iss. 36


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