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Using wafer leve underfill for 3D packaging

dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorGerets, Carine
dc.contributor.authorBeyne, Eric
dc.contributor.authorLa Manna, Antonio
dc.date.accessioned2021-10-19T18:01:26Z
dc.date.available2021-10-19T18:01:26Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19673
dc.sourceIIOimport
dc.titleUsing wafer leve underfill for 3D packaging
dc.typeOral presentation
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceSemicon Europa
dc.source.conferencedate11/10/2011
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec


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