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Plasma sealing of advanced organic low-k material

dc.contributor.authorSmirnov, Evgeny
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorHuffman, Craig
dc.contributor.authorVanstreels, Kris
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-19T19:02:09Z
dc.date.available2021-10-19T19:02:09Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19807
dc.sourceIIOimport
dc.titlePlasma sealing of advanced organic low-k material
dc.typeOral presentation
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference4th International Workshop on Plasma Etch and Strip in Microelectronics - PESM
dc.source.conferencedate3/05/2011
dc.source.conferencelocationMechelen Belgium
imec.availabilityPublished - open access


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