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Ultra-thin chip package (UTCP) and stretchable circuit technologies for wearable ECG system

dc.contributor.authorSterken, Tom
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorTorfs, Tom
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-19T19:15:33Z
dc.date.available2021-10-19T19:15:33Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19835
dc.sourceIIOimport
dc.titleUltra-thin chip package (UTCP) and stretchable circuit technologies for wearable ECG system
dc.typeProceedings paper
dc.contributor.imecauthorSterken, Tom
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.source.peerreviewno
dc.source.beginpage6886
dc.source.endpage6889
dc.source.conference33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society - EMBC
dc.source.conferencedate30/08/2011
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec


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