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3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance

dc.contributor.authorSun, Xiao
dc.contributor.authorPosada Quijano, Guillermo
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorZhang, Wenqi
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorDiekmann, C.
dc.contributor.authorEggs, C.
dc.contributor.authorSchmidhammer, E.
dc.date.accessioned2021-10-19T19:23:25Z
dc.date.available2021-10-19T19:23:25Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19852
dc.sourceIIOimport
dc.title3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance
dc.typeProceedings paper
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage127
dc.source.endpage130
dc.source.conference41st European Solid-State Device Research Conference - ESSDERC
dc.source.conferencedate12/09/2011
dc.source.conferencelocationHelsinki Finland
imec.availabilityPublished - open access


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