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Assembly and packaging integration challenges for 3D systems

dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-19T19:26:14Z
dc.date.available2021-10-19T19:26:14Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19858
dc.sourceIIOimport
dc.titleAssembly and packaging integration challenges for 3D systems
dc.typeProceedings paper
dc.contributor.imecauthorSwinnen, Bart
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceSemicon Japan
dc.source.conferencedate7/12/2011
dc.source.conferencelocationChiba Japan
imec.availabilityPublished - open access


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