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On modeling and optimizing Cost in 3D stacked-ICs

dc.contributor.authorTaouil, Mottaqiallah
dc.contributor.authorHamdioui, Said
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-19T19:31:49Z
dc.date.available2021-10-19T19:31:49Z
dc.date.issued2011-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19870
dc.sourceIIOimport
dc.titleOn modeling and optimizing Cost in 3D stacked-ICs
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage24
dc.source.endpage29
dc.source.conferenceIEEE 6th International Design and Test Workshop (IDT'11)
dc.source.conferencedate11/12/2011
dc.source.conferencelocationBeirut Lebanon
dc.identifier.urlhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6123096
imec.availabilityPublished - imec


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