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Simultaneous etching and deposition processes during the etching of silicon with a Cl(2)/O(2)/Ar inductively coupled plasma

dc.contributor.authorTinck, Stefan
dc.contributor.authorBogaerts, A.
dc.contributor.authorShamiryan, Denis
dc.date.accessioned2021-10-19T19:41:43Z
dc.date.available2021-10-19T19:41:43Z
dc.date.issued2011
dc.identifier.issn1612-8850
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19892
dc.sourceIIOimport
dc.titleSimultaneous etching and deposition processes during the etching of silicon with a Cl(2)/O(2)/Ar inductively coupled plasma
dc.typeJournal article
dc.source.peerreviewyes
dc.source.beginpage490
dc.source.endpage499
dc.source.journalPlasma Processes and Polymers
dc.source.issue6
dc.source.volume8
imec.availabilityPublished - imec


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