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Void detection in copper interconnects using Energy Dispersive X-Ray Spectroscopy

dc.contributor.authorTsigkourakos, Menelaos
dc.contributor.authorHantschel, Thomas
dc.contributor.authorFranquet, Alexis
dc.contributor.authorConard, Thierry
dc.contributor.authorCarbonell, Laure
dc.contributor.authorVandervorst, Wilfried
dc.date.accessioned2021-10-19T19:55:42Z
dc.date.available2021-10-19T19:55:42Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19920
dc.sourceIIOimport
dc.titleVoid detection in copper interconnects using Energy Dispersive X-Ray Spectroscopy
dc.typeMeeting abstract
dc.contributor.imecauthorHantschel, Thomas
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecHantschel, Thomas::0000-0001-9476-4084
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpageTH-20
dc.source.conferenceInternational Conference on Frontiers of Characterization and Metrology for Nanoelectronics
dc.source.conferencedate24/05/2011
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - open access


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