Flipchip bonding of thin Si dies onto PET foils: possibilities and applications

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Authors
van den Brand, Jeroen; Kusters, Roel; Cauwe, Maarten; van den Ende, Daan; Erinc, Muge
Conference
Proceedings of the 18th European Microelectronics and Packaging Conference - EMPC
Title
Flipchip bonding of thin Si dies onto PET foils: possibilities and applications
Publication type
Proceedings paper
Embargo date
9999-12-31
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