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Flipchip bonding of thin Si dies onto PET foils: possibilities and applications
Publication:
Flipchip bonding of thin Si dies onto PET foils: possibilities and applications
Date
2011
Proceedings Paper
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25308.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van den Brand, Jeroen
;
Kusters, Roel
;
Cauwe, Maarten
;
van den Ende, Daan
;
Erinc, Muge
Journal
Abstract
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Views
1998
since deposited on 2021-10-19
Acq. date: 2025-10-29
Citations
Metrics
Views
1998
since deposited on 2021-10-19
Acq. date: 2025-10-29
Citations