dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Lofrano, Melina | |
dc.contributor.author | Willems, Geert | |
dc.date.accessioned | 2021-10-19T20:43:28Z | |
dc.date.available | 2021-10-19T20:43:28Z | |
dc.date.issued | 2011-12 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20021 | |
dc.source | IIOimport | |
dc.title | Green mold compounds: impact on second level interconnect reliability | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Lofrano, Melina | |
dc.contributor.imecauthor | Willems, Geert | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Willems, Geert::0000-0002-9137-618X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 283 | |
dc.source.endpage | 288 | |
dc.source.conference | 13th IEEE Electronics Packaging Technology Conference - EPTC | |
dc.source.conferencedate | 7/12/2011 | |
dc.source.conferencelocation | Singapore Singapore | |
imec.availability | Published - open access | |