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Design of reliable metallization structures for solder flip chip bumps

dc.contributor.authorVandevelde, Bart
dc.contributor.authorVan der Wiel, Appo
dc.date.accessioned2021-10-19T20:43:53Z
dc.date.available2021-10-19T20:43:53Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20022
dc.sourceIIOimport
dc.titleDesign of reliable metallization structures for solder flip chip bumps
dc.typeOral presentation
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.conferenceCOHESI workshop
dc.source.conferencedate24/11/2011
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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