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Chip embedding and fabrication of package stacks using ultra-thin chip packages (UTCPs)

dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-19T20:48:59Z
dc.date.available2021-10-19T20:48:59Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20033
dc.sourceIIOimport
dc.titleChip embedding and fabrication of package stacks using ultra-thin chip packages (UTCPs)
dc.typeOral presentation
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.conferenceIMAPS Spring Event
dc.source.conferencedate9/06/2011
dc.source.conferencelocationEindhoven The Netherlands
imec.availabilityPublished - imec


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