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Effect of bake/cure temperature of an advanced organic ultra low-k material on the interface adhesion strength to metal barriers

dc.contributor.authorVanstreels, Kris
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorFerchichi, Abdelkarim
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorConard, Thierry
dc.contributor.authorOno, Yukiharu
dc.contributor.authorMatsutani, Mihoko
dc.contributor.authorNakatani, Koji
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-19T20:52:18Z
dc.date.available2021-10-19T20:52:18Z
dc.date.issued2011
dc.identifier.issn0021-8979
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20040
dc.sourceIIOimport
dc.titleEffect of bake/cure temperature of an advanced organic ultra low-k material on the interface adhesion strength to metal barriers
dc.typeJournal article
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorConard, Thierry
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.source.peerreviewyes
dc.source.beginpage74301
dc.source.journalJournal of Applied Physics
dc.source.issue7
dc.source.volume109
imec.availabilityPublished - imec


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