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Cleaning aspects of novel materials after CMP

dc.contributor.authorVos, Rita
dc.contributor.authorWada, M.
dc.contributor.authorArnauts, Sophia
dc.contributor.authorTakahashi, H.
dc.contributor.authorCuypers, Daniel
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMertens, Paul
dc.date.accessioned2021-10-19T21:33:33Z
dc.date.available2021-10-19T21:33:33Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20119
dc.sourceIIOimport
dc.titleCleaning aspects of novel materials after CMP
dc.typeProceedings paper
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorArnauts, Sophia
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorMertens, Paul
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage671
dc.source.endpage676
dc.source.conferenceCMP and Post-CMP Cleaning
dc.source.conferencedate14/03/2011
dc.source.conferencelocationShanghai China
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 34, Issue 1


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