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A Parylene temporary packaging technique for MEMS wafer handling

dc.contributor.authorWen, L.
dc.contributor.authorWouters, K.
dc.contributor.authorCeyssens, F.
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorPuers, Bob
dc.date.accessioned2021-10-19T21:46:38Z
dc.date.available2021-10-19T21:46:38Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20144
dc.sourceIIOimport
dc.titleA Parylene temporary packaging technique for MEMS wafer handling
dc.typeProceedings paper
dc.contributor.imecauthorPuers, Bob
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1501
dc.source.endpage1504
dc.source.conferenceEurosensors XXV
dc.source.conferencedate4/09/2011
dc.source.conferencelocationAthens Greece
dc.identifier.urlwww.sciencedirect.com
imec.availabilityPublished - open access
imec.internalnotesProcedia Engineering; Vol. 25


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