Show simple item record

3D system integration - opportunities and challenges

dc.contributor.authorZhang, Wenqi
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T22:20:11Z
dc.date.available2021-10-19T22:20:11Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20209
dc.sourceIIOimport
dc.title3D system integration - opportunities and challenges
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceAdvanced Packaging Technologies Consortium (APTC) Workshop
dc.source.conferencedate14/03/2011
dc.source.conferencelocationShanghai China
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record