Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections

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Authors
Zhang, Wenqi; Dimcic, Biljana; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe
Conference
61st Electronic Components and Technology Conference - ECTC
Title
Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections
Publication type
Proceedings paper
Embargo date
9999-12-31
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