Show simple item record

Fine pitch micro-bump interconnections for advanced 3D chip stacking

dc.contributor.authorZhang, Wenqi
dc.contributor.authorLimaye, Paresh
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-19T22:21:43Z
dc.date.available2021-10-19T22:21:43Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20212
dc.sourceIIOimport
dc.titleFine pitch micro-bump interconnections for advanced 3D chip stacking
dc.typeProceedings paper
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage523
dc.source.endpage528
dc.source.conferenceChina Semiconductor Technology International Conference - CSTIC
dc.source.conferencedate13/03/2011
dc.source.conferencelocationShanghai China
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 34, Issue 1


Files in this item

Thumbnail
Name:
22173.pdf
Size:
501.6Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record