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Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections

dc.contributor.authorZhang, Wenqi
dc.contributor.authorLimaye, Paresh
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T22:22:14Z
dc.date.available2021-10-19T22:22:14Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20213
dc.sourceIIOimport
dc.titleNi/Cu/Sn bumping scheme for fine-pitch micro-bump connections
dc.typeProceedings paper
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage312
dc.source.endpage316
dc.source.conferenceIEEE-CPMT 61st Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2011
dc.source.conferencelocationLake Buena Vista, FL US
imec.availabilityPublished - imec


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