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Ge STI CMP using fixed abrasive pads

dc.contributor.authorZhao, Ming
dc.contributor.authorOng, Patrick
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-19T22:29:08Z
dc.date.available2021-10-19T22:29:08Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20226
dc.sourceIIOimport
dc.titleGe STI CMP using fixed abrasive pads
dc.typeProceedings paper
dc.contributor.imecauthorZhao, Ming
dc.contributor.imecauthorOng, Patrick
dc.contributor.orcidimecZhao, Ming::0000-0002-0856-851X
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.source.peerreviewno
dc.source.beginpage265
dc.source.endpage271
dc.source.conferenceInternational Conference on Planarization/CMP Technology - ICPT
dc.source.conferencedate9/11/2011
dc.source.conferencelocationSeoul Republic of Korea
imec.availabilityPublished - imec


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