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Evaluation of wet Cu seed deposition to enable downscaling damascene metallization

dc.contributor.authorArmini, Silvia
dc.contributor.authorLi, Muyang
dc.contributor.authorSwerts, Johan
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorCaluwaerts, Rudy
dc.contributor.authorMeersschaut, Johan
dc.contributor.authorFranquet, Alexis
dc.contributor.authorMoussa, Alain
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-20T10:02:34Z
dc.date.available2021-10-20T10:02:34Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20307
dc.sourceIIOimport
dc.titleEvaluation of wet Cu seed deposition to enable downscaling damascene metallization
dc.typeMeeting abstract
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.imecauthorMeersschaut, Johan
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorMoussa, Alain
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecMeersschaut, Johan::0000-0003-2467-1784
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.source.peerreviewno
dc.source.beginpageC5.2
dc.source.conferenceMRS Spring Conference Symposium C: Interconnect Challenges for CMOS Technology
dc.source.conferencedate8/04/2012
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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