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Ultra-low copper baths for sub-35nm copper interconnects

dc.contributor.authorAtanasova, Tanya
dc.contributor.authorCarbonell, Laure
dc.contributor.authorCaluwaerts, Rudy
dc.contributor.authorTokei, Zsolt
dc.contributor.authorStrubbe, Katrien
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-20T10:02:49Z
dc.date.available2021-10-20T10:02:49Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20312
dc.sourceIIOimport
dc.titleUltra-low copper baths for sub-35nm copper interconnects
dc.typeProceedings paper
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage83
dc.source.endpage97
dc.source.conferenceProcessing Materials of 3D Interconnects, Damascene and Electronics Packaging
dc.source.conferencedate9/10/2011
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 41, Issue 43


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