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Interconnect materials challenges for sub 20 nm technology nodes: ultra low-k dielectrics

dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-20T10:04:18Z
dc.date.available2021-10-20T10:04:18Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20337
dc.sourceIIOimport
dc.titleInterconnect materials challenges for sub 20 nm technology nodes: ultra low-k dielectrics
dc.typeMeeting abstract
dc.source.peerreviewyes
dc.source.conferenceIEEE 11th International Conference on Solid-State and Integrated Circuit Technology - ICSICT
dc.source.conferencedate29/10/2012
dc.source.conferencelocationXi'an China
imec.availabilityPublished - imec


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