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dc.contributor.authorCiofi, Ivan
dc.contributor.authorMannarino, Manuel
dc.contributor.authorLi, Yunlong
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-20T10:18:18Z
dc.date.available2021-10-20T10:18:18Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20465
dc.sourceIIOimport
dc.titleSelf-controlled constant-current temperature stress for triangular voltage sweep measurements of Cu
dc.typeProceedings paper
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorMannarino, Manuel
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage113
dc.source.endpage123
dc.source.conferenceProcessing Materials of 3D Interconnections, Damascene and Electronics Packaging
dc.source.conferencedate9/10/2011
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec
imec.internalnotesECS Transactions; Vol. 41, Issue 43


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