dc.contributor.author | Degraeve, Robin | |
dc.contributor.author | Goux, Ludovic | |
dc.contributor.author | Clima, Sergiu | |
dc.contributor.author | Govoreanu, Bogdan | |
dc.contributor.author | Chen, Yangyin | |
dc.contributor.author | Kar, Gouri Sankar | |
dc.contributor.author | Roussel, Philippe | |
dc.contributor.author | Pourtois, Geoffrey | |
dc.contributor.author | Wouters, Dirk | |
dc.contributor.author | Altimime, Laith | |
dc.contributor.author | Jurczak, Gosia | |
dc.contributor.author | Groeseneken, Guido | |
dc.contributor.author | Kittl, Jorge | |
dc.date.accessioned | 2021-10-20T10:38:00Z | |
dc.date.available | 2021-10-20T10:38:00Z | |
dc.date.issued | 2012 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20579 | |
dc.source | IIOimport | |
dc.title | Modeling and tuning the filament properties in RRAM metal oxide stacks for optimized stable cycling | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Degraeve, Robin | |
dc.contributor.imecauthor | Goux, Ludovic | |
dc.contributor.imecauthor | Clima, Sergiu | |
dc.contributor.imecauthor | Govoreanu, Bogdan | |
dc.contributor.imecauthor | Chen, Yangyin | |
dc.contributor.imecauthor | Kar, Gouri Sankar | |
dc.contributor.imecauthor | Roussel, Philippe | |
dc.contributor.imecauthor | Pourtois, Geoffrey | |
dc.contributor.imecauthor | Jurczak, Gosia | |
dc.contributor.imecauthor | Groeseneken, Guido | |
dc.contributor.orcidimec | Goux, Ludovic::0000-0002-1276-2278 | |
dc.contributor.orcidimec | Clima, Sergiu::0000-0002-4044-9975 | |
dc.contributor.orcidimec | Roussel, Philippe::0000-0002-0402-8225 | |
dc.contributor.orcidimec | Pourtois, Geoffrey::0000-0003-2597-8534 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1 | |
dc.source.endpage | 2 | |
dc.source.conference | International Symposium on VLSI Technology, Systems, and Applications - VLSI-TSA | |
dc.source.conferencedate | 23/04/2012 | |
dc.source.conferencelocation | Hsinchu Taiwan | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6210101 | |
imec.availability | Published - open access | |